Design and Test of Computers: The Current State of Test Compression. / IEEE, IEEE Computer Society y IEEE Circuits and Systems Society

Colaborador(es): Tipo de material: Recurso continuoRecurso continuoIdioma: Inglés Detalles de publicación: Nueva Jersey​, Estados Unidos: IEEE Computer Society 2008Descripción: v. ; 27 cmISSN:
  • 0740-7475
Tema(s): Clasificación CDD:
  • D457
Contenidos:
112-Guest Editors' Introduction: Progress in Test Compression. 114-Historical Perspective on Scan Compression. 122-VirtualScan: Test Compression Technology Using Combinational Logic and One-Pass ATPG. 132-UMC-Scan Test Methodology: Exploiting the Maximum Freedom of Multicasting. 142-Hierarchical Test Compression for SoC Designs. 150-Loopback DFT for Low-Cost Test of Single-VCO-Based Wireless Transceivers. 160-Wireless System for Microwave Test Signal Generation. 168-An Illustrated Methodology for Analysis of Error Tolerance. 178-Device Model for Ballistic CNFETs Using the First Conducting Band. 188-Discussing DRAM and CMOS Scaling with Inventor Bob Dennard.
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Publicación Periódica Publicación Periódica Biblioteca Rafael Meza Ayau Hemeroteca D457 2008 (Navegar estantería(Abre debajo)) 01 Disponible 41147

112-Guest Editors' Introduction: Progress in Test Compression. 114-Historical Perspective on Scan Compression. 122-VirtualScan: Test Compression Technology Using Combinational Logic and One-Pass ATPG. 132-UMC-Scan Test Methodology: Exploiting the Maximum Freedom of Multicasting. 142-Hierarchical Test Compression for SoC Designs. 150-Loopback DFT for Low-Cost Test of Single-VCO-Based Wireless Transceivers. 160-Wireless System for Microwave Test Signal Generation. 168-An Illustrated Methodology for Analysis of Error Tolerance. 178-Device Model for Ballistic CNFETs Using the First Conducting Band. 188-Discussing DRAM and CMOS Scaling with Inventor Bob Dennard.

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