Design and Test of Computers: Special Issue on Postsilicon Calibration and Repair for Yield and Reliability Improvement. / IEEE, IEEE Computer Society y IEEE Circuits and Systems Society

Colaborador(es): Tipo de material: Recurso continuoRecurso continuoIdioma: Inglés Detalles de publicación: Nueva Jersey​, Estados Unidos: IEEE Computer Society, 2010Descripción: v. ; 27 cmISSN:
  • 0740-7475
Tema(s): Clasificación CDD:
  • D457
Contenidos:
4-Guest Editors' Introduction: Managing Uncertainty through Postfabrication Calibration and Repair. 6-Analog Signature- Driven Postmanufacture Multidimensional Tuning of RF Systems. 18-Self-Healing Phase-Locked Loops in Deep-Scaled CMOS Technologies. 26-Postsilicon Adaptation for Low-Power SRAM under Process Variation. 36-The Dawn of Predictive Chip Yield Design: Along and Beyond the Memory Lane. 46-A Built-in Method to Repair SoC RAMs in Parallel. 58-Runtime Thermal Management Using Software Agents for Multi- and Many-Core Architectures.
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Publicación Periódica Publicación Periódica Biblioteca Rafael Meza Ayau Hemeroteca D457 2010 (Navegar estantería(Abre debajo)) 01 Disponible 48677

4-Guest Editors' Introduction: Managing Uncertainty through Postfabrication Calibration and Repair. 6-Analog Signature- Driven Postmanufacture Multidimensional Tuning of RF Systems. 18-Self-Healing Phase-Locked Loops in Deep-Scaled CMOS Technologies. 26-Postsilicon Adaptation for Low-Power SRAM under Process Variation. 36-The Dawn of Predictive Chip Yield Design: Along and Beyond the Memory Lane. 46-A Built-in Method to Repair SoC RAMs in Parallel. 58-Runtime Thermal Management Using Software Agents for Multi- and Many-Core Architectures.

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